{"id":383,"date":"2019-08-21T12:23:59","date_gmt":"2019-08-21T12:23:59","guid":{"rendered":"https:\/\/intelteh.hr\/?post_type=product&#038;p=383"},"modified":"2021-03-31T16:38:29","modified_gmt":"2021-03-31T16:38:29","slug":"zalijevanje-elektronike","status":"publish","type":"product","link":"https:\/\/intelteh.hr\/en\/products\/zalijevanje-elektronike\/","title":{"rendered":"ELECTRONIC ENCAPSULATION"},"content":{"rendered":"<p>Electronic encapsulation is the process of covering a printed circuit board assembly or filling an electromechanical assembly with a protective material.<\/p>\n<p>Encapsulation with protective material helps to improve the reliability and performance of complex or extremely delicate electronic components against the most demanding environments (moisture, dust, extreme temperature\u2026)<\/p>\n<p>Many manufacturers want in this way to encapsulate, stamp and isolate sensitive electrical and electronic components from damage.<\/p>","protected":false},"excerpt":{"rendered":"<div class=\"proizvod_opis\">\n<ul>\n<li>Potting electronics<\/li>\n<\/ul>\n<\/div>\n<div id=\"tabs_jquery\">\n<div class=\"tab_select\"><\/div>\n<\/div>\n","protected":false},"featured_media":384,"template":"","meta":[],"product_cat":[23],"product_tag":[],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v20.12 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>ELECTRONIC ENCAPSULATION | intelteh<\/title>\n<meta name=\"description\" content=\"Usluga zalijevanja elektroni\u010dkih komponenti je proces kojim se za\u0161titnim materijalom zalijevaju tiskane elektroni\u010dke plo\u010dice ili elektromehani\u010dki sklopovi...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/intelteh.hr\/products\/zalijevanje-elektronike\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" 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